Quick-Turn Prototype IC Assembly
Aeroflex RAD offers the following assembly services: Quick-Turn Prototype IC Assembly in ceramic, etched out plastic, COB and flip chip.
Quick-Turn Prototype IC Assembly Capabilities:
- Dicing, Die Visual and Die Attach
- Wafer Dicing (up to 12inch wafers)
- Visual Inspection (50-500X)
- Conductive and non-conductive epoxy die attach
- Silver Glass and Eutectic die attach
- Flip Chip
- Wirebond, Encapsulation and Marking
- Gold and Aluminum Wirebond (to 35um pitch)
- Epoxy, Solder, and Glass Frit Lid Seal
- Dam and Fill (Plastic Encapsulation)
- Plastic Equivalent Devices
- COB Glob Top
- Package Ink Marking or Laser Marking
- Package Options
- Multi-chip / Stacked Modules, Chip-On-Board (COB) and Custom Substrates
- Ceramic Packages Including: BGA, PGA, J-Lead, Flat Pack, QFP, Sidebraze, Cerdip and others
- Etched Cavity Plastic Packages Including: J-Lead, QFP, SOIC, TSSOP, QFN /MLF and others
Die / Package Thinning and Die Extraction / Repackaging
- Die backside thinning
- Package backside thinning to 35um ̉5um thickness
- Die extraction and re-bonding
- PC board design
Quality
- DSCC MIL-STD-883 and MIL-STD-750 Laboratory Suitability
- ISO 9001:2008 Certification
Roadmap
- DSCC QML Cert for MIL-PRF-38535 and MIL-PRF-19500
- AS9100 Certification
