Aeroflex Microelectronic Solutions
From GaAs to silicon. No one provides a more comprehensive approach to handling all your
requests for standard and custom Schottkys, PINs, NIPs, varactors, detectors, limiters, capacitors, resistors, inductors, attenuator pads,
and so much more.And they come delivered every way imaginable, from wafers
to plastic surface mount.
Element Evaluation, Environmental Screening
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Table 1 -
MIL-PRF-38534 Element Evaluation for Passive Components
|
|||||
Step
|
Class
|
Process
|
Conditions
|
Comments
|
|
K
|
H
|
||||
1
|
Subgroup 1
|
||||
2
|
X
|
X
|
Die Electrical
|
Rs(Resistors) Vr, Cj (Capacitors)
|
100% electrical, remove
rejects
|
3
|
Subgroup 2
|
||||
4
|
X
|
X
|
Die Visual
|
MIL-STD-883, Meth 2032
|
100% visual inspection, |
5
|
Subgroup 3
|
||||
6
|
X
|
Temperature Cycling
|
MIL-STD-883, Meth 1010, Cond C
|
10 Cycles, t= 10 minutes
min, |
|
7
|
X
|
Constant Acceleration
|
MIL-STD-883, Meth 2001, Cond D
|
20,000 g’s, Y1 direction
|
|
8
|
X
|
Aging (Capacitors only)
|
MIL-STD-883, Meth 1015, Cond A
|
t= 240 hrs min, Ta= +125∞
C, |
|
9
|
X
|
X
|
Visual Inspection
|
MIL-STD-883, Meth 2017
|
|
10
|
X
|
X
|
End-point Electricals
|
Rs (Resistors) Vr, Ir, Ct (Capacitors)
|
Read & Record
|
11
|
Subgroup 4
|
||||
12
|
X
|
X
|
Bond Strength
|
MIL-STD-883, Meth 2011 |
.001” Au wire or
equivalent, |
Table 2 - MIL-PRF-38534 Element Evaluation for Semiconductor Die
|
|||||
Step
|
Class
|
Process
|
Conditions
|
Comments
|
|
K
|
H
|
||||
1
|
|
|
Subgroup 1
|
||
2
|
X
|
X
|
Die Electrical
|
|
100% electrical, remove
rejects
|
3
|
|
|
Subgroup 2
|
||
4
|
X
|
X
|
Die Visual
|
MIL-STD-883, Meth 2010
|
100% visual inspection,
remove rejects
|
5
|
|
|
Subgroup 3
|
||
6
|
X
|
X
|
Internal Visual
|
MIL-STD-883,Meth 2010 or
MIL-STD-750, Meth 2072 or 2073
|
|
7
|
|
|
Subgroup 4
|
||
8
|
X
|
|
Temperature Cycling
|
MIL-STD-883, Meth 1010, Cond C
|
10 Cycles, t= 10 minutes
min, |
9
|
X
|
X
|
Constant Acceleration
|
MIL-STD-883, Meth 2001, Cond D
|
20,000 g’s Y1 direction
|
10
|
X
|
X
|
Pre Burn-In Electrical
|
|
Go/No Go
|
11
|
X
|
|
HTRB
|
MIL-STD-883, Meth 1015, Cond A
|
t= 240 hrs min, Ta= +125°
C, |
12
|
X
|
X
|
Post Burn-In Electrical
|
|
Go/No Go
|
13
|
X
|
|
Steady State Life |
MIL-STD-883, Meth 1005, Cond B
|
t= 1000 hrs min, Ta= +125°
C, Vr= __V or If=__mA
|
14
|
X
|
X
|
Final Electricals
|
|
Read & Record
|
15
|
|
|
Subgroup 5
|
||
16
|
X
|
X
|
Bond Strength
|
MIL-STD-883, Meth 2011 |
.001” Au wire or
equivalent, |
17
|
|
|
Subgroup 6
|
||
18
|
X
|
|
SEM
|
MIL-STD-883, Meth 2018 or |
|
Table 3 - MIL-PRF-19500 100% Environmental Screening
Semiconductor Packaged Diodes
|
||||||
Step
|
Process
|
Conditions
|
Comments
|
JANS
|
JANTXV
|
JANTX
|
1
|
Visual Inspection
|
MIL-STD-750, Meth 2073
|
Performed at chip level prior to assembly
|
X
|
when specified
|
N/A
|
2
|
Pre-cap Visual
|
MIL-STD-750, Meth 2074
|
|
X
|
X
|
N/A
|
3
|
Temperature Storage
|
MIL-STD-750 Meth 1032
|
t=___ hrs, Ta= +150˚ C
|
X
|
X
|
X
|
4
|
Temperature Cycling
|
MIL-STD-750 Meth 1051, Cond F
|
20 Cycles, t(ext)= 10 min Ta= -65∞ C to +150˚ C
|
X
|
X
|
X
|
5
|
Constant Acceleration
|
MIL-STD-750 Meth 2006
|
20,000 G’s min Y1 axis only (Au ribbon/wire bond only)
|
X
|
X
|
X
|
6
|
PIND
|
MIL-STD-750 Meth 2052, Cond A
|
Shock Pulse= 1000 +200 g’s, Noise= +20mV peak to peak
|
X
|
N/A
|
N/
|
7
|
FIST / BIST (axial lead diodes only)
|
MIL-STD-750 Meth 2081(FIST), 2082(BIST)
|
Acc=_, Pulse=_, t=_ms, f=_Hz _blows in_direction,
V=_V,I=_A
|
X
|
N/A
|
N/A
|
8
|
Fine Leak
|
MIL-STD-750 Meth 1071, Cond H
|
5x10-8 atm cc3/s max
|
N/A
|
X
|
X
|
9
|
Gross Leak
|
MIL-STD-750 Meth 1071, Cond C
|
|
N/A
|
X
|
X
|
10
|
Inital Electricals
|
Ir (or as
specified)
|
Read & Record serialeze diode
|
X
|
X
|
X
|
11
|
HTRB1
|
MIL-STD-750 Meth 1038, Cond A
|
t= 48 hrs min, Ta= +150˚ C, Vr=
______V
|
X
|
X
|
X
|
12
|
Interim Electricals
|
Ir (or as
specified)
|
Read & Record w/in 16 hrs from removal of applied bias
|
X
|
X
|
X
|
13
|
Delta HTRB Measurements
|
Delta Ir= + _nA or 100% whichever is greater
|
Read & Record delta Ir from
Initial to Interim electricals
|
X
|
X
|
X
|
14
|
PDA2
|
PDA = 5% max, Actual PDA = ___
|
PDA = (qty rej delta Ir/qty acc delta Ir) x 100
|
X
|
X
|
X
|
15
|
Forward Burn In |
MIL-STD-750 Meth 1038, Cond B
|
t= 240 hrs min, Ta= + __˚C, If=___ mA
|
X
|
X
|
X
|
16
|
Final Electricals
|
Ir (or as
specified)
|
Read & Record w/in 96 hrs from removal of applied bias
|
X
|
X
|
X
|
17
|
Delta Forward B Measurements
|
Delta Ir= + __nA or 100% whichever is greater
|
Read & Record delta Ir from
Interim to Final electricals
|
X
|
X
|
X
|
18
|
PDA (Note 2)
|
PDA = 5% max, Actual PDA = ___
|
PDA = (qty rej delta Ir/qty acc delta Ir) x 100
|
X
|
X
|
X
|
19
|
Fine Leak
|
MIL-STD-750 Meth 1071, Cond H
|
5x10-8 atm cc3/s max
|
X
|
N/A
|
N/A
|
20
|
Gross Leak
|
MIL-STD-750 Meth 1071, Cond C
|
|
X
|
N/A
|
N/A
|
21
|
Radiography
|
MIL-STD-750, Meth 2076
|
2 views, X and Y
|
X
|
N/A
|
N/A
|
22
|
Externa Visual
Inspection
|
MIL-STD-750 Meth 2071
|
|
X
|
N/A
|
N/A
|
Notes:
1 - Burn-In methods and conditions to be provided by Customer and agreed upon
by Aeroflex / Metelics engineering.
2 - PDA for JANTX & JANTXV level screening is +10%; PDA for JANS level
screening is +5%.
Table 4 - MIL-PRF-19500 Group A Conformance Inspection (all
levels)
|
|||
Group
A Inspection
|
Sample Size (Note 1)
|
Conditions
|
Comments
|
Subgroup 1
|
|||
Visual & Mechanical Inspection
|
15
|
MIL-STD-750, Meth 2071
|
|
Subgroup 2
|
|||
Electrical Tests
|
116 (45) |
Ta= +25˚ C
|
Read & Record (satisfied with 100% Post BI data)
|
Subgroup 3
|
|||
DC (static) tests
|
116 (45) |
Ta= -_____˚ C
|
Read & Record Ta= min rated operating temperature
|
DC (static) tests
|
116 (45) |
Ta= +_____˚ C
|
Read & Record Ta= max rated operating temperature
|
Subgroup 4
|
|||
Dynamic tests
|
116 (45) |
Ta= +25˚ C
|
|
Table 5 -
MIL-PRF-19500 Group B Conformance Inspection
|
|||||||
Group B Inspection
|
Sample
size |
Conditions
|
Comments
|
JANS
|
JANTXV
|
JANTX
|
|
Subgroup 1 (Note 4)
|
Electrical rejects may be
used
|
|
|
|
|||
Physical Dimensions
|
22 (8)
|
MIL-STD-750 Meth 2066
|
Specified case outline
dimensions
|
X
|
N/A
|
N/A
|
|
Subgroup 2 (Note 4)
|
Electrical rejects may be
used
|
||||||
Solderability
|
15 (6)
leads
|
MIL-STD-750 Meth 2026
|
Leads from a minimum of 3
devices shall be tested
|
X
|
X
|
X
|
|
Resistance to Solvents
|
15 (6)
|
MIL-STD-750 Meth 1022
|
|
X
|
X
|
X
|
|
Subgroup 3 (Note 4)
|
|||||||
Temperature Cycling
|
22 (6)
|
MIL-STD-750 Meth 1051, Cond F
|
45 Cycles including
screening, t(ext)= 10 min Ta= -65˚ C to +150˚ C (JANS 100 cycles)
|
X
|
X
|
X
|
|
Thermal Shock
|
22 (6)
|
MIL-STD-750 Meth 1056, Cond B
|
10 Cycles (JANS 25 cycles)
(glass axial lead only)
|
X
|
X
|
X
|
|
Surge
|
22 (6)
|
|
only when specified
|
X
|
X
|
X
|
|
Fine Leak
|
22(6)
|
MIL-STD-750, Meth 1071, Cond H
|
5x10-8 atm cc3/s max
|
X
|
X
|
X
|
|
Gross Leak
|
22 (6)
|
|
MIL-STD-750 Meth 1071, Cond C
|
X
|
X
|
X
|
|
Electrical Tests3
|
22 (6)
|
|
Read & Record
|
X
|
X
|
X
|
|
Intermittent Operating
Life
|
22 (12)
|
MIL-STD-750 Meth 1037,
2000 cycles
|
submit to 6000 cycles to
satisfy Grp C Subgrp 6
requirement
|
N/A
|
X
|
X
|
|
Electrical Tests3
|
22 (12)
|
|
Read & Record
|
N/A
|
X
|
X
|
|
De-cap Internal Visual
|
6 (6)
|
MIL-STD-750 Meth 2075
|
Decap devices
|
X
|
X
|
X
|
|
Bond Strength
|
22 (12)
wires or 1 (6) devices
|
MIL-STD-750 Meth 2037
|
use for die shear
|
X
|
X
|
X
|
|
SEM
|
22 (12)
|
MIL-STD-750, METH 2077
|
when specified
|
X
|
X
|
X
|
|
Die Shear
|
11 (6)
|
MIL-STD-750, METH 2017
|
use bond pull samples
|
X
|
N/A
|
N/A
|
|
Subgroup 4 (Note 4)
|
|||||||
Intermittent Operating
Life
|
22 (12)
|
MIL-STD-750 Meth 1037,
2000 cycles
|
submit to 6000 cycles to
satisfy Grp C Subgrp 6
requirement
|
X
|
N/A
|
N/A
|
|
Electrical Tests
|
22 (12)
|
|
Read & Record satisfy |
X
|
N/A
|
N/A
|
|
Subgroup 5 (Note 4)
|
|||||||
Accelerated Steady State
Life
|
22 (12)
|
MIL-STD-750, Meth 1027 *Schottky= Tj max, 240 hrs
|
t= 96 hrs, Ta= +275˚
C Vr=__V(pk), lo=__mA, f=__Hz
|
X
|
N/A
|
N/A
|
|
Electrical Tests3
|
22 (12)
|
|
Read & Record
|
X
|
N/A
|
N/A
|
|
Subgroup 6 (Note 4)
|
|||||||
Thermal Resistance
|
22 (8)
|
MIL-STD-750 Meth 408 (Meth
3101 option JANS)
|
Read & Record
|
X
|
X
|
X
|
|
High Temp Life
(Non-operating)
|
22 (12)
|
MIL-STD-750 Meth 1032
|
t= 340 hrs, Ta= T STG(MAX)
|
N/A
|
X
|
X
|
|
Electrical Tests3
|
22 (12)
|
|
Read & Record
|
N/A
|
X
|
X
|
|
Notes:
1.
Small lot sample size defined in parentheses (
). Inspection lot quantity shall not exceed 2,500 pcs for JANTX & JANTXV Group A small lot sampling;
inspection lot quantity shall not exceed 1,000 pcs for JANS Group A small lot sampling. Group B small lot sampling: inspection lot
quantity shall not exceed 1,000 pcs for JANS Group B
small lot sampling.
2.
Electrical test parameters shall be defined by
product type and specific requirements; test limits at temperature may vary
from those published in this catalog.
3.
Endpoint electrical tests parameters shall be defined
by product type and specific requirements.
4.
Test sequence may differ according to JAN
screening level.
Table 6 -
MIL-PRF-19500 Group C Conformance Inspection (all levels)
|
|||
Group
C Inspection
|
Sample |
Conditions
|
Comments
|
Subgroup 1
|
|||
Physical Dimensions
|
15 (6)
|
MIL-STD-750, Meth 2066
|
|
Subgroup 2
|
|||
Thermal Shock
|
22 (6)
|
MIL-STD-750 Meth 1056, Cond A
|
glass axial lead only
|
Terminal Strength
|
22 (6)
|
MIL-STD-750 Meth 2036, Cond E
|
leaded packages only, |
Fine Leak
|
22 (6)
|
MIL-STD-750 Meth 1071, Cond H
|
5x10-8 atm cc3/s max
|
Gross Leak
|
22 (6)
|
MIL-STD-750 Meth 1071, Cond C
|
|
Moisture Resistance
|
22 (6)
|
MIL-STD-750, Meth 1021
|
Omit initial conditioning
|
End-point Electricals2
|
22 (6)
|
Read & Record
|
|
Subgroup 3
|
|||
Shock
|
22 (6)
|
MIL-STD-750 Meth 2016
|
Non-operating,1500G, 0.5ms, |
Variable Frequency
|
22 (6)
|
MIL-STD-750 Meth 2056
|
|
Acceleration
|
22 (6)
|
MIL-STD-750 Meth 2006
|
1 minute min, 20K G X1, Y1, Z1
|
End-point Electricals2
|
22 (6)
|
Read & Record
|
|
Subgroup 4
|
|||
Salt Atmosphere
|
15 (6)
|
MIL-STD-750, Meth 1041
|
Electrical rejects may be used
|
Subgroup 5
|
|||
Thermal Resistance
|
15 (6)
|
MIL-STD-750, Meth 4081
|
Read & Record
|
Subgroup 6
|
|||
Intermittent Operating Life
|
22 (12)
|
MIL-STD-750, Meth 1037 6000 cycles
|
Units from Group B-2000 cycle test may be used to complete the
6000 cycles
|
End-point Electricals2
|
22 (12)
|
Read & Record
|
|
Bond Strength
|
11 wires
|
MIL-STD-750 Meth 2037
|
Only when Group B units continue to satisfy Group C
requirement, Read & Record
|
Subgroup 7
|
|||
Internal Water Vapor
|
3
|
MIL-STD-750, Meth 1018
|
3 devices c= 0 or 5 devices c= 1
|
Notes:
1.
Small lot sample size
defined in parentheses ( ). Inspection lot quantity shall not exceed 2,500 pcs for JANTX & JANTXV Group A small lot sampling; inspection lot quantity shall not exceed 1,000 pcs for JANS Group A small lot sampling.
2. Electrical test parameters shall be defined by product type and specific requirements; test limits at temperature may vary from those published in this catalog.
